Design for assembly handbook


















This is done by reducing the number of components or parts in the product design and ensuring the parts are easily assembled. DFA techniques are intended to arrive at a simpler product structure and assembly system. Design for assembly includes a distinct design methodology that considers product functionality along with the cost and efficiency of the product assembly process. Design choices go a long way in ensuring the quality and reliability of the end product.

The land pattern design and spacing for each component package will affect the comprehensive reliability and timeline requirements for the PCBA along with the repairability of the board.

Sufficient spacing between components on the board guards against possible faults such as solder-bridging while enabling easier manual soldering or rework. While greater spacing facilitates greater ease of assembly, some applications need close spacing to accomplish a smaller form factor.

Understanding assembly defects and their root causes can help a fabricator in enhancing the quality of the PCBA and boosting manufacturing yield. The most common board assembly defects are as follows:. As electronic components are available in different packages, assembly costs might also depend on the component packaging.

BGAs and QFNs come with a higher cost due to the electrical connections beneath the components that require a higher level of accuracy for component placement. They also need X-ray inspection to look for voids and short circuits between the pins. The assembly cost for boards depends on various factors such as initial setup costs, stencil cost and programming.

Economies of scale come into play here, as high-volume production runs will bring down one-time set-up costs. Prototype boards might need a different set-up for each run or even each board, which will add to the cost of the boards manufactured. Lorem ipsum dolor sit amet. Vivamus fermentum felis in lacus mattis,. Vivamus fermentum. Bruce Feige. Ryan Tullius Design Engineer. Download Design Guide. Get the Controlled Impedance Design Guide. Get the Controlled Impedance Design Guide We help you get your impedance right the first time When and why you need controlled impedance Stack-up design guidelines How to design for impedance Common mistakes to avoid.

Brand Logo. What is design for assembly? The objectives of design for assembly. Recommended layout for components The land pattern design and spacing for each component package will affect the comprehensive reliability and timeline requirements for the PCBA along with the repairability of the board. Common PCB assembly defects Understanding assembly defects and their root causes can help a fabricator in enhancing the quality of the PCBA and boosting manufacturing yield. The most common board assembly defects are as follows: Open solder joints opens Solder bridges shorts Component shift.

Factors that impact the cost of the PCB assembly. This course is most effective when attended by product development team members; however, this is not a requirement for attendance. NOTE: You are strongly encouraged to bring a sample or drawing of one of your own designs to analyze during the workshop on Day Two. You are also asked to bring a calculator capable of making simple calculations. I strongly recommend this course to any engineer; this will definitely broaden their scope and insight at work.

Thank you SAE. You must complete all course contact hours and successfully pass the learning assessment to obtain CEUs. Kevin Zielinski currently owns and operates Red Cedar Media LLC, a training and corporate communications consulting, design, development and delivery company based in Michigan. He has designed, developed and delivered over 40 lecture- and web-based courses attended by General Motors and EDS employees worldwide. McFarland Award April He holds a bachelor's and master's degree in engineering from Wayne State University.

Learning Objectives By attending this seminar, you will be able to: Perform Design for Assembly DFA Analysis using the BDI Manual Worksheet Method Perform DFM Analysis manufacturing cost estimation Apply Design for Service DFS Principles Reduce your company's production costs by analyzing and eliminating the factors that greatly affect the time, cost, and quality of manufacturing, assembly and service processes Utilize effective analysis, brainstorming, and trade-off techniques for redesigning assemblies and subassemblies Who Should Attend Product designers, product engineers, or manufacturing engineers will benefit by attending this seminar.



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